Our capability

Layer:1-30layers

Material Type:FR-4 ,FR-4 Halogen free ,CEM-1,CEM-3,High-Tech

Board Thickness:0.4mm-3.0mm

Copper Thickness:0.5OZ-3.0OZ

Copper Thickness In Hole:>25.0um(>1.0mil)

The Max Board Size

A:Board Thickness≥1.2mm,not jack panel :605*530mm.(HASL:605*450)

B:Board Thickness≥1.2mm,jack panel:550*400

C:Board Thickness0.5-1.2mm:400*350

D:Board Thickness0.4mm:350*300

E:Single-sided board:605*530mm(above: 1.2mm)

F:Six -layer board:430*430mm

G:Eight-layer board:430*430mm

H:Above eight-layer board:270*280mm

Surface finishing :HASL,LFHASL,HAL,Chemical Tin,Chemical Gold,Immersion Sliver/Gold,OSP,Gold Plating

Solder mask color:white ,black,yellow,red,green ,blue

Profiling:Punching,Routing,V-CUT